Ideal for rough cutting and slotting on all PCB materials, particularly effective for cutting copper foil substrates and fine lines such as PCB gold fingers. Available in both upward chip evacuation (for forming machines) and downward chip evacuation (for depaneling machines) designs.Features: TiSiCrN (black) and ZrCN (gold) nano-multilayer coatings on the cutting edge for enhanced durability, cutting stability, extended tool life, and reduced risk of breakage.

Suitable for all PCB materials, copper substrates, aluminum substrates, etc. Available in both upward chip evacuation (for forming machines) and downward chip evacuation (for depaneling machines) designs.
Features: TiSiCrN (black) and ZrCN (gold) nano-multilayer coatings on the cutting edge for enhanced durability, cutting stability, extended tool life, and reduced risk of breakage.

Ideal for rough cutting and slotting on all PCB materials. Available in both upward chip evacuation (for forming machines) and downward chip evacuation (for depaneling machines) designs.