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Headless

local_offer Headless

Ideal for use in semiconductor lead frames, LED lead frames, and precision metal stamping parts for consumer electronics.

最新
  • Detailed Introduction

Range of Processing:
Diameter Range: 0.2 ~ 3.3 MM
Shank Diameter: 2.0 ~ 4.0 MM
Total Length: 25.0 ~ 55.0 MM
Tungsten Carbide Grade: Sumitomo AF312
Surface Roughness: Ra 0.2