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Guide Punch
Ideal for use in semiconductor lead frames, LED lead frames, and precision metal stamping parts for consumer electronics.
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- Detailed Introduction
Range of Processing:
Diameter Range: 1.18 ~ 5.0MM
Shoulder Diameter: 3.8 ~ 6.5 MM
Total Length: 13.6 ~ 33.2 MM
Tungsten Carbide Grade: Sumitomo AF312
Surface Roughness: Polished to Ra 0.2 or below