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Round Punch

local_offer Round Punch

Ideal for use in semiconductor lead frames, LED lead frames, and precision metal stamping parts for consumer electronics.

最新
  • Detailed Introduction

Range of Processing:

Diameter Range: 0.27 ~ 7.36 MM

Shoulder Diameter: 4.5 ~ 10.0 MM

Total Length: 50.5 ~ 72.0 MM

Tungsten Carbide Grade: JT302

Surface Roughness: Polished to Ra 0.2 or below